Traduction de «Composant sans fil monté en surface » (Français → Anglais) :

surface mounted leadless component

operator of SMT machine | operator of surface-mount technology machine | SMT machine operator | surface-mount technology machine operator

surface-mounted component [ SMC | surface-mount device | surface mounted device ]

surface mount component | SMC | surface-mount component | surface mounted component | surface mount device | surface mounted device | SMD

surface mounted device | SMD [Abbr.]

surface mounting device

A suitable apparatus is illustrated in the figure and consists of a motor-driven cam, the follower of which is attached by wires to a small trolley mounted on a track.

The effects on external surfaces of the hydrogen components in their installed position shall be considered in relation to the following:

– Nano-electronics, photonics and integrated micro/nano-systems: process, device, design and testing technologies and methodologies to improve size, density, performance, energy efficiency, manufacturing and cost-effectiveness of components, systems-on-a-chip, systems-in-a-package and integrated systems; advanced wireless components and sub-systems; basic photonic components to generate, manipulate and detect light for a wide range of applications including ultra fast components ; RF systems; high-performance/high-density data storage systems; very large area and/or highly integrated flexible display solutions; sensing, actuating, ...[+++]vision and imaging devices; ultra low power systems, alternative energy sources/storage; heterogeneous technologies/systems integration; smart systems; multi-functional integrated micro-nano-bio-info systems; large-area electronics; integration in different materials/objects; interfacing with living organisms; (self-)assembly of molecules or atoms into stable structures.

– Nano-electronics, photonics and integrated micro/nano-systems: process, device, design and testing technologies and methodologies to improve size, density, performance, energy efficiency, manufacturing and cost-effectiveness of components, systems-on-a-chip, systems-in-a-package and integrated systems; advanced wireless components and sub-systems; basic photonic components to generate, manipulate and detect light for wide range of applications including ultra fast components; RF systems; high-performance/high-density data storage systems; very large area and/or highly integrated flexible display solutions; sensing, actuating, vis ...[+++]ion and imaging devices; ultra low power systems, alternative energy sources/storage; heterogeneous technologies/systems integration; smart systems; multi-functional integrated micro-nano-bio-info systems; large-area electronics; integration in different materials/objects; interfacing with living organisms; (self-)assembly of molecules or atoms into stable structures.